Fico Sawing Line
The Fico Sawing Line is a cutting-edge solution designed specifically for high-precision sawing of semiconductor strips. Leveraging the latest advancements in automation and process control, this system delivers exceptional accuracy, throughput, and flexibility tailored to today’s demanding semiconductor manufacturing environments.
Equipped with advanced blade management, coolant control, and real-time monitoring systems, the Fico Sawing Line maximizes uptime, ensuring consistent, high-quality output.
Experience the next level of strip sawing precision and productivity with the Fico Sawing Line, engineered to meet the evolving challenges of semiconductor strip processing.
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99.98% Yield
> 2.0 Cpk
34,000 UPH in bulk
3.8 m2 Footprint
Key Features
Explore all features of the Fico Sawing Line
General
- Extreme warpage handling (best warpage handling in the market)
- Improved output with new 6-head sorting
- Improved accuracy – 25 μm offset/size accuray optionally available
- Step-cut sawing (option)
High output
- Fully parallel processing with dedicated units
- Balanced throughput with optimal process performance
- Production output up to 34,000 UPH
Large Substrate Handling
- Capable of handling substrate sizes of up to 100 x 300 mm
- Fully prepared for future increase of high density substrate approach
Fast Conversion
- Fast & easy product conversion to different substrate & product size
- No tools required and completely automatic alignment of all product related parts
Upside Down Sawing
- Substrates and products are handled in a “live bug” (contacts down) state throughout the system
- End product is fixed from the top side
- Substrate is cut from below
- Cut scrap falls automatically into the waste bin
- Minimal risk of scrap hitting the sawing blade
High Accuracy
- All substrates are fully analyzed with the pre-alignment feature, operating in parallel with the sawing process (zero time loss)
- The sawing process is taking into account all specific substrate shape and geometry deviations
- Final package accuracy of ±50 μm at Cpk > 2.0 (6-sigma process control)
Other Features
- Automatic tray feeder
- Rework tray
- 3 reject bins
- 6 head product sorting
- 2.5 kW spindle power
- 3″ blades (70 – 80 mm)
Specifications
The Fico Sawing Line in numbers
Machine Dimensions
| Width | 3657 mm |
| Depth | 1487 mm |
| Height | 1820 mm |
| Weight | approx. 3500 kg (empty) |
Strip dimensions
| Width | 28 – 100 mm |
| Length | 60 – 300 mm |
| Thickness | 6 mm |
| Product size | 1.6 x 1.6 – 50 x 50 mm |
Magazine dimensions
| Width | max. 120 mm |
| Length | max. 320 mm |
| Height | max. 240 mm |
| Buffer capacity | 640 mm |
Supply requirements
| Voltage | 208-230-380-400-440-460-480VAC – 3~ |
| Frequency | 50 / 60 Hz |
| Current at 50 Hz | 28/25/14/13/12 A |
| Current at 60 Hz | 35/31/18/16/15 A |
| Footprint | 3.8 m2 |
| Ambient temperature | 15 – 40 oC |
| Water consumption | 500 l/h |
| Compressed air | 5 – 10 bar |
| Average air consumption | 5.5 m3/h at 5 bar |
| Factory exhaust | 300 m3/h at 50 Hz |
Equipment performance
| Uptime | ≥ 99% |
| MTBF | ≥ 200 h |
| MTBA | ≥ 4 h |
| Output | max. 34,000 UPH |
| Size accuracy | ±50 µm |
| Offset accuracy | ±50 µm |
| Capability / Cpk | > 2.0 |
