Datacon 8800 FC QUANTUM advanced
As mass reflow Flip Chip technology becomes the dominant force in IC packaging, Besi once again leads the industry by redefining speed and productivity with the Datacon 8800 FC QUANTUM advanced.
Engineered with state-of-the-art motion control, the innovative CRYSTAL – a glass-based fluxer concept – and enhanced computing power, this system delivers unparalleled performance and cost efficiency.
Discover how the Datacon 8800 FC QUANTUM advanced can transform your Flip Chip packaging operations with speed, accuracy, and reliability like never before.
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up to 10,000 UPH
5 micron Accuracy
0.3 - 20 mm Die size
0.5 - 50 N Bond force
Key features
Explore all features of the Datacon 8800 FC QUANTUM advanced
Unprecedented Speed
- Unique patent pending CRYSTAL concept (glass based fluxer with simultaneous inspection)
- Enhanced trajectories and motion control
- Highest speed with full process control
Full Yield Control
- Full Process & Production control
- Superior usability with enhanced Pseudo X-Ray
- Fast Post Bond Inspection
Proven production Accuracy
- 5 µm accuracy at highest speed
- Lowest vibration with SMART path filtering
- Enhanced Matrix BMC test
Shortest Lead time
- Lean production process
- Aligned with proven Besi production process
- Uniform QA system installed at contract manufacturers
Specifications
The Datacon 8800 FC QUANTUM advanced in numbers
| X/Y placement accuracy | ± 5 µm @ 3 sigma |
| Bond force | 2N – 50 N (0.5 – 10 N option) |
| Die size | 0.3 – 20 mm |
| Die thickness | 50 µm – 3 mm |
| Wafer size | 4″ – 12″ (on 8″ or 12″ wafer frames) |
| Substrate types | Singulated substrates in boats, strips, leadframe, wafer in carrier |
| Working range | 13″ x 8″ |
| Flux film thickness | Various cavity plates available |
| Size | WxDxH – 1,600 mm x 1,200 mm x 1,940 mm |
| Weight | 2,000 kg |
| UPH | up to 10,000 (application dependant) |
| Vision system | 12 x 12 mm FoV for substrate, wafer and upwards camera |
