Esec 2100 SSI
The Esec 2100 SSI builds on the proven Esec 2100 12-inch die bonder family by integrating the innovative Phi-Y Pick & Place concept with a versatile Soft Solder Indexer that accommodates a wide range of leadframes. Its advanced Dispensing and Pre-pressing System delivers optimal soft solder processing for today’s demanding high-power packages.
With an optional high-force, closed-loop 300N capability, the Esec 2100 SSI offers exceptional versatility and performance for diffusion soldering and direct sintering across various leadframe types. Combined with Besi’s patented Soft Solder Process Technologies, it sets a new standard in process control and productivity, helping you maintain a competitive edge.
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300 N Bond force
15 - 102 mm Leadframe width
90 - 300 mm Leadframe length
> 200 h MTBF
Key features
Explore all features of the Esec 2100 SSI
Leading Edge Machine Concept
- Dedicated Real-time OS for tight process control
- High performance P&P and Dispensing Technology
- Constant status control with real-time wafer, strip and magazine viewers
- Real-time process monitoring through live images of the Pick and Bond process zone
Best Process Quality
- Lowest gas consumption
- Patented dispensing and bonding technology.
- Closed-loop bond force control and auto force referencing (300N option).
- Process visualization and display of bond force curve during process setup (300N option).
Widest Application Range
- Handling of strips up to 300 x 102 mm
- Process Down Holders with up to 75N force
- Smart Push-In (SPI) and Smart Push-Out (SPO)
- Convenient application and strip data import via product kit dongle
Fastest Time to Yield
- Recipe transfer from machine to machine enables fast conversion
- Supports Soft Solder, High Force Diffusion and Direct Sintering processes
- Assisted Teach/Setup workflows and teach parameter verification to eliminate setup errors
- Enhanced application flexibility and exchange of product-specific parts for fastest product changeovers.
Leading Edge Process Control
- Advanced atmosphere control
- 4 programmable gas flow zones
- Air cooling and vacuum flow monitoring
- 8 programmable heater zones
- Accurate and flexible temperature profile settings
Specifications
The Esec 2100 SSI in numbers
Accuracy / Productivity
| Soft Solder accuray | 50 μm / 0.8° @ 3σ |
| Eutectic / Diffusion accuracy | 35 μm / 0.5° @ 3σ |
| Dry cycle time | 265 ms |
| MTBF | > 200h |
Process
| Bond force | 0.2 – 50 N (300 N optional) |
| Bond rotation | 360° |
| Gas flow zones | 4 (programmable) |
| Heating zones | 8 (programmable) |
Leadframe size
| Width | 15 – 102 mm (max. 4”) |
| Length | 90 – 300 mm |
| Thickness | 0.1 – 2.0 mm |
| Downset | max. 2.5 mm |
Wafer & Die dimensions
| Wafer size | 4” – 12” |
| Frame size | 8” – 12” |
| Die size | 0.5 – 15 mm |
| Die thickness | > 0.075 mm |
Soft Solder Indexer (SSIN)
| Strip handling | up to 300 x 102 mm |
| Process Down Holders | up to 75 N force |
Supply Requirements
| Voltage | 208 – 240 VAC 1P / 3P Delta (@ 47-63 Hz) |
| Voltage | 360 – 415 VAC 3P Wye (@ 47-63 Hz) |
| Power rating | typical 3,000 VA, max. 10,500 VA |
| Compressed air | min. 5.2 bar |
| Vacuum | min. -0.75 bar |
| Forming gas | min. 2.2 bar |
Machine Dimensions
| Footprint | WxDxH – 2,500 x 1,448 x 1,400 mm |
| Weight | approx. 1,650 kg |
Options
All available options on the Esec 2100 SSI
Input Handler
- Magazine Handler Input (MHIN2)
Substrate Handler
- Power Marking Unit (PMU)
- Process DownHolder P1 (PDP1)
Pick & Place
- High Force 300 N Option
Die Ejector – Process Modules
- Dual Stage Die Ejector
Vision
- Strip Vision Input (SVI)
- Strip Reader QR (SVIQR)
Automation
- Wafer Mapping inclusive Conversion
- Host Communication Interface
- E142 Strip Mapping (SMP)
- Transfer Logging (TLOG)
- Material Tracking (MTR)
Dual Dispense Solder
- Pre Press Head System 1 (PPHS1)
- Wire Dispense Head System 2 (WDHS2)
Miscellaneous
- Uninterruptible Power Supply to PC (UPS)
- Ionizer-Controlled Pick (IONC-P)
- Ionizer-Controlled WH Load Top (IONC-WT)
- Ionizer-Controlled Magazine Input (IONC-MHIN)
