Datacon 2200 evo hF
The Datacon 2200 evo hF is the most versatile platform for Power Modules, IGBT, MCM, and SiP applications. Highly configurable, it features an integrated dispenser, SEMI-compliant 12″ wafer handling, multiple pick & place and eject tools, I/O systems, and application-specific options.
Setting new benchmarks, the Datacon 2200 evo hF delivers a bond force up to 500N and exceptional machine accuracy of ±10 µm @ 3σ. Equipped for successful mass production, it supports both current and future processes and products with unmatched reliability.
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10 micron Accuracy, @ 3 sigma
± 0,15° Theta placement
500 N Bond force
99.95% Yield
Key Features
Eplore all features of the Datacon 2200 evo hF
High force bonding
- Bond force 500 N
- Hot bond head
- Closed loop process control (force and temperature control)
Sintering
- Sinter film handling
- Sinter paste dispensing
- Pre-applied sinter paste
Heating
- 450°C tool
- 300°C substrate
Specifications
The Datacon 2200 evo hF in numbers
Accuracy
| X/Y placement accuracy | ± 10 µm @ 3s |
| Theta placement accuracy | ± 0.15° @ 3s |
Bond heads
| Standard bond head | 0° – 360° rotation |
| Heated bond head | up to 450°C (optional) |
| Bond Force | 0.5 – 500 N |
System dimensions
| LxDxH | 1,160 x 1,225 x 1,800 mm |
| Weight | 1,300 kg |
Statistics
| Uptime | > 98% |
| Yield | > 99.95% |
Wafer handling
| Die size – die attach | 0.17 – 50 mm |
| Die thickness | 0.17 – 7 mm |
| Wafer size | 2 – 12″ (50 – 300 mm) |
Chip tray handling
| Waffle pack / Gel pack | 2 x 2″ and 4 x 4″ |
| JEDEC tray | on request |
Substrates and carriers
| Substrate heating | 350°C (optional) |
| Substrate working range | 12” x 7” (300 mm x 175 mm) |
Options
| Hardware | Open platform architecture for full customization |
| Software | Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition and more |
