Esec 2100 hS
The Die Bonder Esec 2100 hS is the third generation of the most flexible 300 mm high-speed platform, designed for a wide range of epoxy die attach applications including QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA.
This user-friendly system simplifies production control and assistance, delivering a quantum leap in throughput and yield while minimizing cost of ownership.
The innovative platform concept was honored with the prestigious Swiss Technology Award at its launch.
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20 micron Bonding accuracy
0.25 - 20 mm Die size
0.2 - 20 N Bond force
120 ms Cycle time
Key Features
Explore all features of the Esec 2100 hS
Leading Edge Machine Concept
- Real time process monitoring through 4 live images of process zone
- Constant status control with real time wafer, strip and magazine viewer
- Efficient learning and error recovery thanks to context sensitive online help
Highest Up Time
- Real time process monitoring through 4 live images of process zones
- Constant status control with real time wafer, strip and magazine viewer
- Efficient learning and error recovery thanks to context sensitive online help
Highest Speed at 20 µm Accuracy
- Very short pick & place cycle time due to the revolutionary Phi-Y concept combining rotational and linear movements
- New “light&rigid” pick & place structure, advanced trajectory control as well as a liquid cooling system ensuring excellent accuracy at highest speed
- Placement accuracy down to 15 µm (3 sigma) using High Accuracy Mode
Fastest time to Yield
- Tool-less exchange of product specific parts for fastest product changeovers
- Teach and setup wizards and parameter teach verification eliminate setup errors
- Recipe transfer from machine to machine enables fast conversion
- Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic
The Platform of the Future
- New controller hardware using Gigabit Ethernet communication enabling advanced processes
- Next generation platform ensuring upgrades and expansion of functionalities at any time
- Scalable performance & application range
Specifications
The Esec 2100 hS in numbers
Specifications
| Bonding method | Epoxy |
| Cycle time | 120 ms with Liquid Cooling option |
| Bonding accuracy | 20 μm @ 3σ (15 μm option) |
| Wafer size | 4′ to 12″ (on 8″ or 12″ wafer frames) |
| Die size | 0.25 mm (with Small Die Kit) to 20 mm |
| Leadframe length | 90 – 300 mm |
| Leadframe width | 23 – 100 mm |
| Machine dimensions | WxDxH – 1,785 x 1, 448 x 1,400 mm |
Options
Available options on the Esec 2100 hS
Substrate handler
- Dual Input (MHIN and TOS)
- Magazine Handler Input (MHIN only)
- Raildownholder
- Motorized Downholder Disp/Bond
- Strip Marking Unit
- Strip Thickness Compensation
- Strip Handler 100 mm cold Flat
- Strip Handler 100 mm hot Flat
- Strip Handler 100 mm hot Rail
- Strip Handler 100 mm cold taped QFN
- Strip Handler 100 mm hot taped QFN
- Roll-Out Slippage Check
- SMEMA Link Input
- SMEMA Link Output
- Pick Strip from Box
Dispenser
- PDS Epoxy Level Detection
- PDS Purge and Pre-Dispense Station
- Multi Dispense Process
Pick & Place
- Liquid Cooling System
- Massflow Die Sensor
- Small Die Kit
- High Accuracy Mode
Die Ejector
- Dual Stage Die Ejector
Vision
- Indirect Illumination (BVI/DVI)
- Dispense Vertical Indirect Illumination (DVIILL)
- Dispense Quality Check
- Bond Quality Check
- Bond Vertical Indirect Illumination (BVIILL)
Automation
- Wafer Mapping including Conversion
- Host Communication Interface
- E142 Strip Mapping (CSR required)
Miscellaneous
- Uninterruptible Power Supply to PC
- Ionizer Pick
- Ionizer Bond
- Ionizer Controlled Pick (IONC-P)
- Ionizer Controlled Bond (IONC-B)
- Ionizer Controlled Dispense (IONC-D)
- Ionizer Controlled WH Load Top (IONC-WT)
- Ionizer Controlled WH Load Bottom (IONC-WB)
- Ionizer Controlled Magazine Input (IONC-MHIN)
- Fine Filter Unit
- Fine Filter Unit with Air Particle Sensor
