Esec 2100 SC
The Esec 2100 SC is the most flexible 300 mm high-speed die bonder, designed to handle smart card tape applications with ease.
It offers effortless operation, comprehensive production assistance, and precise control, driving significant improvements in throughput and yield while maintaining the lowest cost of ownership.
This innovative platform was honored with the prestigious Swiss Technology Award at its launch.
More informationThis link leads to an external website.
25 micron Bonding accuracy
0.5 - 20 mm Die size
Epoxy Bond method
35 mm Tape size
Key Features
Explore all features of the Esec 2100 SD
Leading Edge Machine Concept
- Single clamp transport system
- 100% post bond QC inspection at high speed
- Key alignment tasks performed by cameras make many mechanical adjustments obsolete
- Optional 3 zone heating for pre-curing (accuracy) and void control (dehumidification)
Highest Up Time
- Real time process monitoring through 4 live images of process zones
- Constant status control with real time wafer, strip and magazine viewer
- Efficient learning and error recovery thanks to context sensitive online help
Highest Speed at 25 µm Accuracy
- Phi-Y Pick and Place with symmetrical design for short settling time resulting in highest UPH
- Best placement accuracy through vibration control
- Highest stiffness for highest speed AND accuracy
Fastest time to Yield
- Tool-less exchange of product and easy loading of material for fastest product changeovers
- Teach and setup wizards and parameter teach verification eliminate setup errors
- Recipe transfer from machine to machine enables fast conversion
The Platform of the Future
- 3rd generation pick and place
- 50 N bond force standard
- Third process station enables easy adaptation to future leading-edge applications
Specifications
The Esec 2100 SD in numbers
Specifications
| Bonding method | Epoxy |
| Bonding accuracy | Down to 20 μm @ 3σ |
| Wafer size | 4′ to 12″ (on 8″ or 12″ wafer frames) |
| Die size | 0.5 to 20 mm |
| Tape size width | 35 mm |
| Leadframe width | 23 – 100 mm |
| Machine dimensions | WxDxH – 3,040 x 1,448 x 1,680 mm |
Options
Available options on the Esec 2100 hS
Section “Tape Handler”
- Tape Handler 35mm hot (TPH35h)
- Tape Input Handler (TIH)
- Tape Output Handler (TOH)
- Tape Input Buffer (TIB)
- Tape Output Handler Simplified (TOHS)
- Tape Output Handler Detached (TOHD)
- Tape Output Handler Detached Simplified (TOHDS)
Dispenser
- PDS Epoxy Level Detection
- PDS Purge and Pre-Dispense Station
Pick & Place
- Massflow Die Sensor
- Small Die Kit
Vision
- Indirect Illumination (BVI/DVI)
- Dispense Vertical Indirect Illumination (DVIILL)
- Dispense Quality Check
- Bond Quality Check
- Bond Vertical Indirect Illumination (BVIILL)
- Pick Indirect Illumination (PIILL) – CSR required
Automation
- Wafer Mapping including Conversion
- Host Communication Interface
Miscellaneous
- Uninterruptable Power Supply to PC
- Ionizer Pick
- Ionizer Bond
- Fine Filter Unit
- Fine Filter Unit with Air Particle Sensor
