Datacon 8800 FC QUANTUM hS
Building on the industrial benchmark set by the Datacon QUANTUM series, the Datacon 8800 FC QUANTUM hS system significantly boosts production speed beyond the successful Datacon FC QUANTUM advanced, delivering unprecedented Cost of Ownership benefits.
This high-speed Flip Chip bonder maintains uncompromised 4μm accuracy and process control, ensuring tool-to-tool repeatability and the highest yield.
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up to 16,000 UPH
4 micron Accuracy
1 - 14 mm Die size
0.5 - 50 N Bond force
Key features
Explore all features of the Datacon 8800 FC QUANTUM hS
Extra Speed +100% Improved CoO
- Innovative “Quattro” multi nozzle concept
- Synchronous process steps
- High resolution large FoV camera systems
- Cluster adjust capability for bonding position alignment
Accuracy
- Proven accuracy 4μm @ 3s
- Enhanced 26MP camera system
- Optimized movements with Real Cross Influence
- New Matrix BMC 2.0
Full Yield Control
- Full Process & Production Control
- Superior usability with enhanced Pseudo X-Ray
- Fast Post Bond Inspection
- Individual Eject – Flip – and P&P – Toolinspection
- Chipping – / Die Crack detection
Ease of Use
- Minimal tooling quantity – fast device change over
- No die transfer shuttle – no intermediate steps
- Simple recovery handling
- Auto nozzle offset correction
Specifications
The Datacon 8800 FC QUANTUM hS in numbers
| X/Y placement accuracy | ± 4 µm @ 3 sigma |
| Bond force | 0.5 – 5 N |
| Die size | 1- 14 mm |
| Die thickness | 70 µm – 3 mm |
| Wafer size | 8″ – 12″ (on 8″ or 12″ wafer frames) |
| Substrate types | Singulated substrates in boats, strips, leadframe, wafer in carrier |
| Working range | 13″ x 8″ |
| Flux film thickness | Various cavity plates available |
| Size | WxDxH – 1,600 mm x 1,200 mm x 1,940 mm |
| Weight | 2,000 kg |
| UPH | up to 16,000 (application dependant) |
| Vision system | 16 x 16 mm FoV for substrate camera 29 x 29 mm FoV for wafer and upwards camera |
