Datacon 8800 CHAMEO advanced
Wafer-Level Fan-Out Packaging (WL-FOP) is an innovative, cost-effective solution designed to meet the growing demands for enhanced performance, compact form factors, and superior warpage control.
The Datacon 8800 CHAMEO advanced bonder elevates a field-proven platform to new heights, making it the ideal choice for chip attach in any WL-FOP process.
It supports both face-down (flip mode) and face-up (non-flip mode) package designs, offering unmatched versatility and reliability.
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up to 7,000 UPH
3 micron Accuracy
0.3 - 30 mm Die size
2 - 50 N Bond force
Key features
Explore all features of the Datacon 8800 CHAMEO advanced
Multi-Chip – Combining Speed, Flexibility and Accuracy
- Multi-chip capability – Flexibility on smallest footprint
- Single pass is king – Improve your Cpk for multi-FC packages
- Waffle pack feeders – Extend your possibilities
- Extra Speed up to +40%
Enhanced Capabilities – Ready for the Future
- Leadframe, strip, boat, wafer – No limits for your substrates
- Customized features – Exactly tailored for your process
- 300 mm / 340 mm Fan Out Wafer Level Packages (FO-WLP) Carrier
- Face-down & Face-up (recipe controlled)
- Clean room class ISO 5
- Foup load port
- Tape & Reel
Highest Accuracy – Capturing Tomorrow’s Markets
- Highest Accuracy ± 5 µm / 3 µm @ 3 Sigma
- Local reflow – Mastering sophisticated assemblies
- Long-term stability – Securing high yield at high speed
Wafer Level Applications
- Fan-Out Wafer Level Packages – Highest performance for lowest cost
- Advanced Chip to Wafer – Cost effective dual die stacking
- Through Silicon Vias (TSV) – Entry ticket to the future
Specifications
The Datacon 8800 CHAMEO advanced in numbers
| X/Y placement accuracy local | ± 3 µm @ 3 sigma (± 2µm @ 3sigma option) |
| X/Y placement accuracy global | ± 5 µm @ 3 sigma |
| Bond force | 2 – 50 N (0.5 – 10 N option) |
| Die size face down | 0.3 – 40 mm |
| Die size face up | 2.5 – 25 mm |
| Die thickness | 50 µm – 3 mm |
| Wafer size | 8″ – 12″ (on 8″ or 12″ wafer frames) |
| Strip, Boats, Panels | Up to 340 mm |
| Substrate wafer | 12″ |
| Fluxer | option, various cavity plates available |
| Multi Chip | included |
| Tape feeder option | tape size 8 – 32 mm |
| Clean room class | ISO5 (option) |
| Footprint | WxDxH – 1,600 x 1,200 x 1,880 mm |
| Weight | 2,000 kg |
| UPH | up to 7,000 |
| Vision system | 6 x 6 mm FoV for substrate and upwards camera 12 x 12mm FoV for wafer camera |
