IMAPS Symposium 2026
Tomorrow’s semiconductor breakthroughs demand smarter, faster, and more efficient packaging solutions. At IMAPS 2026, Besi is unveiling the next generation of assembly and packaging technologies, built to meet the needs of AI, HPC, and heterogeneous integration. Visit our booth to learn more about our innovative solutions.
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As microelectronics and advanced packaging continue to evolve, staying ahead requires cutting-edge solutions in heterogeneous integration, high-performance computing (HPC), AI, and next-gen interconnect technologies. At IMAPS 2026, Besi will present our latest innovations in die attach, packaging, and plating & cleaning equipment, designed to push the limits of precision, efficiency, and scalability.
Join us to explore:
- Advanced Package Structures: Solutions for heterogeneous integration, HPC, and AI applications.
- Next-Generation Interconnects: Innovations in bumping, wirebonding, and advanced interconnect technologies.
- Materials & Equipment: Enabling technologies that enhance reliability and performance in semiconductor packaging.
Visit our booth to discuss how Besi can help you tackle the next generation of packaging challenges!
Event information
