ECTC 2026

Besi is proud to participate in ECTC, showcasing our latest innovations in advanced packaging and assembly technologies. The conference agenda features a comprehensive technical program with papers presenting leading-edge developments and innovations across the packaging spectrum. Key topics include advanced packaging, modeling and simulation, photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Presentations are delivered in both oral and poster formats, with outstanding contributions recognized through awards such as the Intel Best Student Paper Award.

In addition to technical sessions, ECTC offers panel discussions, plenary talks, special sessions, and the EPS Seminar, providing participants with valuable insights from both technical experts and business leaders. These sessions encourage dynamic dialogue on current challenges and future trends in the microelectronics packaging industry.

Besi looks forward to connecting with industry peers and sharing knowledge at this influential event, which is made possible through the support of the IEEE Electronics Packaging Society, corporate sponsors, and the dedication of over 200 engineers and scientists on the Executive and Program Committees.