MiNaPAD 2026
Join Besi at the MiNaPAD conference 2026 in Grenoble, June 3 & 4. Don’t miss our presentation, "Sub micron placement accuracy - the era for heterogeneous integration and optoelectronic assemblies", showcasing cutting-edge advances in optoelectronic technology.
Event information
MiNaPAD 2026 is a premier 2-day conference and exhibition dedicated to advancing the micro and nano-electronics packaging, assembly, design, and manufacturing sectors. The event aims to strengthen collaboration and knowledge exchange between the design community – which represents the largest segment of the European semiconductor industry – and the assembly and packaging community.
Key Components:
- Parallel Technical Sessions:
Focused discussions and presentations on cutting-edge research, innovative design methodologies, packaging technologies, and manufacturing processes. - Exhibition:
Showcase of the latest tools, equipment, materials, and services from leading industry players and research institutions. - Additional Technical Events:
Workshops, panel discussions, and networking opportunities designed to foster collaboration and address current challenges in the semiconductor packaging and design ecosystem.
Objectives:
- Reinforce the synergy between design and packaging communities.
- Promote knowledge sharing and innovation in micro/nano-electronics manufacturing.
- Highlight emerging trends and technologies shaping the future of semiconductor assembly and design.
Event information
