Datacon 2200 evo
The Datacon 2200 evo is a high-accuracy multi-chip die bonder offering ultimate flexibility for die attach and flip chip applications.
Featuring an integrated dispenser, 12” wafer handling, automatic tool changer, and application-specific tooling, it’s designed to support both current and future processes and products.
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10 micron Accuracy, @ 3 sigma
± 0,15° Theta placement
450°C Heated bond head
99.95% Yield
Key Features
Eplore all features of the Datacon 2200 evo
High Performance at High Accuracy
- Highest accuracy ± 10 µm @ 3 Sigma (7 µm upon request)
- High productivity, low cost-of-ownership
- Up to 4 working heads in one machine
Multi-chip capability
- Single pass production for complex products
- Die attach, flip chip, multi-chip in one machine
- Epoxy writing & stamping, flux dipping
Unbeaten Flexibility
- Die pick from wafer, waffle pack, gel pack, feeder
- Die place to carrier, boat, substrate, PCB, lead frame, wafer
- Hot and cold processes supported: epoxy, soldering, thermo-compression
- MCM, SiP, Hybrids
Open Platform Architecture for Full Customization
- Most advanced modular platform concept
- Production line tailored 100% to your needs
- Ideal solution with smallest footprint possible
Specifications
The Datacon 2200 evo in numbers
Performance
| X/Y placement accuracy | ± 10 µm @ 3s |
| Theta placement accuracy | ± 0.15° @ 3s |
| Bond Force | 0.5 N to 75 N programmable |
Output
| Die attach | up to 7,000 UPH/module |
| Flip Chip with dipping | up to 2,500 UPH/module |
| Flip Chip without dipping | up to 3,200 UPH/module |
Bond heads
| Standard bond head | 0° – 360° rotation |
| Heated bond head | up to 450°C (optional) |
| UV Curing | 365 nm & 405 nm |
System dimensions
| LxDxH | 1,160 x 1,225 x 1,750 mm |
| Weight | 1,300 kg |
Statistics
| Uptime | > 98% |
| Yield | > 99.95% |
Wafer handling
| Die size – die attach | 0.17 – 50 mm |
| Die size – Flip Chip | 0.5 – 50 mm |
| Die thickness | > 50 µm |
| Wafer size | 4 – 12″ (SEMI M1) |
| Frame size | FF070, FF105, FF108, FF123; automatic change (others on request) |
Chip tray handling
| Waffle pack / Gel pack | 2 x 2″ and 4 x 4″ |
| JEDEC tray | on request |
Substrates and carriers
| Substrates | FR4, ceramic, BGA, flex, boat, lead frame, waffle pack |
| Carriers | Gel-Pak®, JEDEC tray, odd-shape substrates |
| Substrate working range | 13” x 8” (325 mm x 200 mm) |
Options
| Hardware | Open platform architecture for full customization |
| Software | Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition and more |
