Datacon 2200 evo plus
The Datacon 2200 evo plus die bonder builds on a proven platform with enhanced accuracy, speed, and flexibility for multi-module attach.
Featuring a new camera system, thermal compensation, and advanced image processing, it delivers higher bonding precision, long-term stability, and improved cleanroom performance.
With unmatched customization and multi-chip capability, the evo plus sets new standards in productivity and cost-efficiency.
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7 micron Accuracy, @ 3 sigma
± 0,1° Theta placement
450°C Heated bond head
99.95% Yield
Key Features
Eplore all features of the Datacon 2200 evo plus
Integrated Dispenser
- Pressure/time (Musashi®), Auger, Jetter types available
- Epoxy stamping option
- Filled and unfilled epoxy, wide viscosity range
- Small footprint, low cost-of-ownership
Vision Alignment
- New high-speed image processing unit
- Full alignment & bad mark search
- Pre-defined fiducial geometry & customized teaching
Automatic Wafer and Tool Changer
- Fully automatic cycle for multi-chip production
- Up to 7 pick & place tools (optionally 14), 5 eject tools
- Stamping tools and calibration tools possible
Pick & Place Head
- Die attach, flip chip and multi-chip in one machine
- Die pick from: wafer, waffle pack, Gel-Pak®, feeder
- Die place to: substrate, boat, carrier, PCB, leadframe, wafer
- Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic
Specifications
The Datacon 2200 evo plus in numbers
Performance
| X/Y placement accuracy | ± 7 µm @ 3s |
| Theta placement accuracy | ± 0.10° @ 3s |
| Bond Force | 0.5 N to 75 N programmable |
Output
| Die attach | up to 7,000 UPH/module |
| Flip Chip with dipping | up to 2,500 UPH/module |
| Flip Chip without dipping | up to 3,200 UPH/module |
Bond heads
| Standard bond head | 0° – 360° rotation |
| Heated bond head | up to 450°C (optional) |
| UV Curing | 365 nm & 405 nm |
System dimensions
| LxDxH | 1,160 x 1,225 x 1,750 mm |
| Weight | 1,300 kg |
Statistics
| Uptime | > 98% |
| Yield | > 99.95% |
Wafer handling
| Die size – die attach | 0.15 – 30 mm |
| Die size – Flip Chip | 0.5 – 30 mm |
| Die thickness | > 50 µm (thinner on request) |
| Wafer size | 4 – 12″ (SEMI M1) |
| Frame size | FF070, FF105, FF108, FF123; automatic change (others on request) |
Chip tray handling
| Waffle pack / Gel pack | 2 x 2″ and 4 x 4″ |
| JEDEC tray | on request |
Substrates and carriers
| Substrates | FR4, ceramic, BGA, flex, boat, lead frame, waffle pack |
| Carriers | Gel-Pak®, JEDEC tray, odd-shape substrates |
| Substrate working range | 13” x 8” (325 mm x 200 mm) |
Options
| Hardware | Open platform architecture for full customization |
| Software | Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition and more |
