Datacon 8800 FC QUANTUM ^advX

Besi / Products / Die Attach / Flip Chip

Experience the next generation of Flip Chip assembly with the Datacon 8800 FC QUANTUM ^advX, our most advanced solution yet. Engineered to deliver extraordinary speed and precision, this state-of-the-art system is the perfect choice for high-volume production environments.

Supporting die sizes from 0.3 to 40 mm, the Datacon 8800 FC QUANTUM ^advX offers unmatched versatility to meet the full spectrum of mass reflow Chip-to-Substrate (C2S) applications.

With an outstanding placement accuracy of just 4 μm, it pushes the boundaries of what is possible in small bump mass reflow technology.

More information

up to 10,000 UPH

4 micron Accuracy

0.3 - 40 mm Die size

2 - 50 N Bond force

Key features Specifications

Key features

Explore all features of the Datacon 8800 FC QUANTUM ^advX

Unprecedented Speed

Dual gantry system
Super size CRYSTAL dipping
Newest Besi vision technology

Full Yield Control

Auto needle height determination
Flip touchdown monitoring
Flux depending dipping speed sets

Proven Production Accuracy

4μm at highest speed
High resolution vision system
Thermally optimized gantry system

Application Flexibility

FC-BGA, FC-CSP, DRAM, Fan-out C2W
Die size up to 40 mm
Singulated substrates, strips and wafer

Specifications

The Datacon 8800 FC QUANTUM ^advX in numbers

X/Y placement accuracy	± 4 µm @ 3 sigma (± 3µm @ 3sigma option)
Bond force	2 – 50 N (0.5 – 10 N option)
Die size	0.3 – 40 mm
Die thickness	50 µm – 3 mm
Wafer size	4″ – 12″ (on 8″ or 12″ wafer frames)
Substrate types	Singulated substrates in boats, strips, leadframe, wafer in carrier
Working range	13″ x 8″
Flux film thickness	Various cavity plates available
Size	WxDxH – 1,600 mm x 1,200 mm x 1,791 mm
Weight	2,100 kg
UPH	up to 10,000 (application dependant)
Vision system	12 x 12mm FoV for substrate camera 23 x 23mm FoV for upwards camera 13 x 13mm FoV for wafer camera