Datacon 8800
FC QUANTUM advanced
TEST
Besi’s Hybrid Bonding platform Datacon 8800 CHAMEO ultra plus AC provides ultra-high accuracy at high throughput for the next generations of advanced packaging and high-end modules. Innovative cleanliness concepts in combination with exceptional optical alignment solutions ensure excellent placement performance, making it the tool of choice for high-density interconnects and 3D integration.
By continuously investigating and developing the Hybrid bonding process with all its related aspects, Besi is maintaining the leadership in this emerging technology. Customers will profit from our in-depth knowledge starting at material preparation over tooling design to metrology.
Demonstrations and sample builds with your material can be done on a live machine in one of our labs, either in Singapore or Radfeld (Austria). We are happy to invite you for a visit. Contact us today for more information.
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100 nm accuracy, @ 3 sigma
2,000 max. CPH
12" Wafer size
25 - 800 µm Die thickness
Key features
“Van Gogh” Alignment principle
- Allows for highest placement accuracy through innovative optical solutions in combination with high resolution cameras.
Cleanliness
- Hybrid bonding requires highest cleanliness levels to ensure best yield performance, our machine can provide an ISO3 atmosphere in the working area.
Thin Die Handling
- Knowledge in thin die handling from other Besi platforms integrated in this machine are available, as well as alternative ejection solutions.
Inline IR Inspection
- Yield and and throughput improvement by in-situ IR inspection capability, immediate feedback of placement accuracy without need of unloading material.
Multi Chip Capability
- Flexible production loading through multi chip handling with integrated toolchanging solutions.
Automation
- Full factory automation available, completely automatic product changeover triggered from the host system.
- Transparent process monitoring through broad data interface.
Cluster Integration
- Beside the stand-alone configuration of one bonder with EFEM loading, the unbeaten one-stop cluster integration solution in cooperation with our partner Applied Materials can be offered.
- Fully unleash the process know-how of the whole pre-processing landscape in combination with the leading bonding technology from Besi.
Specifications
System
| Accuracy | 100 nm @ 3 sigma alignment worst corner GOG |
| Accuracy self check | Single BMC kit |
| Cleanliness | ISO3 in working area |
| Throughput | Up to 2,000 CPH (dry cycle) |
Material handling
| Substrate wafer (through EFEM) | 12″ wafer |
| Substrate wafer thickness | 0.5 – 2.0 mm |
Component supply
| Wafer handling | 12″ film frame or 12″ wafer carrier (silicon or glass carrier) |
| Die size | 0.5 x 0.5 mm up to 33 x 28 mm |
| Die thickness | 25 µm up to 800 µm |
| Die ejection methods | Needle, Multi Stage, UV on request |
