Esec 2009 SSI E
Engineered to tackle the toughest challenges in power die attach, the Esec 2009 SSI E die bonder delivers unmatched productivity and process control.
Featuring patented soft solder process technologies, it ensures your leading position in the market.
It is the only soft solder bonder capable of handling 300mm / 12″ wafers (optional), setting a new industry standard.
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8,000 UPH Max. output
60 micron Accuracy
up to 12" Wafer size
1 - 11 mm Die size
Key features
Explore all features of the Esec 2009 SSI E
Highest Speed
- New point to line pick & place
- High speed high accuracy dispensing technology
Best Process Quality
- Lowest gas consumption
- Patented dispensing and bonding technology
- Process visualization
Widest Application Range
- Solution to handle the ultra thin and ultra wide leadframes
- Solution to process power modules
Fastest Time to Yield
- Fast product change over with exchangeable indexer
- User friendly menu structure
- Easy to use mechanical design
Co-development
- Involve in power package design
- Work closely together with customers and suppliers
Ready for the Future
- Expandable machine design
- Multi process capability
- Ultra thin die handling
Specifications
The Esec 2009 SSI E in numbers
Specifications
| Net productivity | 2,500 to 8,000 UPH typical |
| Typical bonding accuracy | 60µm @ 3σ with optical bond centering option: 50µm @ 3σ (product dependent) |
| Solder wire spools | Diameter: max. 155 mm / 6.1” Width: max. 12 mm / 0.47” Mounting hole: 8 mm to 10.5 mm / 0.31” to 0.41” |
| Wafer size | Up to 8″ 12″ optional |
| Die size | 1 x 1 mm to 11 x 11 mm 40 x 40 mils to 430 x 430 mils |
| Machine dimensions | WxDxH – 1,970 x 1,305 x 1,760 mm |
Options
All available options on the Esec 2009 SSI E
Handling
- Magazine Handler Input
- Magazine Handler Output
- Top Stack Loader Wide
- Dual Input Handler
- Dual Power Leadframe Loader
- Dual Power Leadframe Loader 2
- Stack Power
- Power Marker Unit
- Single Wafer Loader
Dispenser
- Programmable Dual Wire Dispenser
- Programmable Pre Press Module
Vision
- Prog. Quality Control Television
- Optical Bond Centering (OBC)
- Pre-bond Vision Inspection (Pre-IQC)
- Post-bond Vision Inspection (Post-IQC)
Miscellaneous Options / Special Applications
- Advanced Thin Die
- Thin Die Pick-up
- Thin Die Pick-up Flexible
- Small Die Kit / Ultra Small Die Kit
- Leadframe Identification
- Uninterruptible Power Supply
- Heated Pepper Pot
- Gas Supply Feature
- Wafer Mapping Package (WMP4, incl. conversion package)
- Host Package
Strip Mapping
All available options on the Esec 2009 SSI E
Strip Mapping E142 on Esec 2009 SSIE soft Solder Die Bonder
Get ready for the next level of ink-less production and full traceability in Soft Solder die bonding. Power packages are getting more and more complex, denser, smaller and quality critical. Strip Mapping E142 applies a virtual map-like representation of the physical world to a lot of common substrate such as e.g. wafers, leadframes and DCBs.
Key Features
Strip Identification
- Able to read 1D barcodes and 2D DataMatrix codes of various formats and sizes
- Preferred StripID location: near leading or trailing edge
Strip Mapping E142
- SEMI E142 compliant strip mapping format
- E142.2 SECS II compliant communication
- Configurable strip map download and upload settings
- TransferMap generation configurable (die level traceability)
- Wafer mapping via Stream12 still available
Benefits
Strip Identification
- Only small StripID code area required (DMC)
- Barcode sometimes more practicable and easier to attach
- No mechanical contact with code area
Strip Mapping E142
- Well known and active standard
- SECS II based communication, easily integrated in existing host systems
- Flexible download, upload and bin code settings
- Transfer map to link wafer position to strip position for full single device traceability
