Esec 2100 FC hS
The Esec 2100 FC hS is the third generation of the market-leading high-speed Flip Chip platform, designed to handle a wide range of applications including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED.
This system offers effortless operation, comprehensive production assistance, and precise control, delivering significant improvements in throughput and yield while minimizing cost of ownership.
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240 ms Cycle time
8 micron Accuracy
4 - 12" Wafer size
16,000 UPH Output
Key features
Explore all features of the Esec 2100 FC hS
Highest Speed at 8 µm Accuracy
- Up to 16,000 UPH
- Very short pick & place cycle time due to the revolutionary Phi-Y concept combining rotational and linear movements
- New “light&rigid” pick & place structure, advanced trajectory control as well as a liquid cooling system ensuring excellent accuracy at highest speed
Leading Edge Machine Concept
- Real time process monitoring through 4 live images of process zone
- Constant status control with real time wafer, strip and magazine viewer
- Efficient learning and error recovery thanks to context sensitive online help
Highest Up Time
- Real time process monitoring through 4 live images of process zones
- Constant status control with real time wafer, strip and magazine viewer
- Efficient learning and error recovery thanks to context sensitive online help
Fastest time to Yield
- Tool-less exchange of product specific parts for fastest product changeovers
- Teach and setup wizards and parameter teach verification eliminate setup errors
- Recipe transfer from machine to machine enables fast conversion
The Platform of the Future
- New controller hardware using Gigabit Ethernet communication enabling advanced processes
- Next generation platform ensuring upgrades and expansion of functionalities at any time
- Scalable performance & application range
Specifications
The Esec 2100 FC hS in numbers
| Bonding method | Flip Chip |
| Bonding accuracy | ± 8 µm @ 3 sigma (High Accuracy Mode) |
| Minimum cycle time | 240 ms (incl. dip fluxing) |
| Wafer size | 4″ – 12″ |
| Frame size | 6″, 8″ and 12″ |
| Die size | 0.2 (with small die kit) to 20 mm |
| Die thickness | ≥ 0.05 mm / ≥ 2 mils (thinner on request) |
| Strip dimensions | Length up to 500 mm Width up to 125 mm (flat boats up to 137 mm) |
| Machine dimensions | WxDxH – 1,430 x 1,440 x 1,400 mm |
| Weight | approx. 1,400 kg / 3,000 lb |
Options
Available options on the Esec 2100 FC hS
Substrate Handler
- Strip Handler 75 mm cold rail
- Strip Handler 100 mm cold rail
- Active-Z Handler 137 mm cold (STH137-AZ)
- Top Stack Loader (TOS)
- Dual Input (MHIN and TOS)
- Magazine Handler Input (MHIN only)
- Magazine Handler Output (MHOUT)
- Rail Downholder
- Motorized Downholder Disp/Bond
- Strip Marking Unit
- SMEMA Link Input
- SMEMA Link Output
Slide Fluxer
- Duplex Slide Fluxer 2
- Duplex Slide Fluxer 3
Dispenser
- PDS Epoxy Level Detection
- PDS Purge and Pre-Dispense Station
- Multi Dispense Process
Die Ejector
- Die Ejector with Motorized X and Y Axis
- Ultra Thin Die Needle Module
Pick & Place
- High Accuracy Mode
- Massflow Die Sensor
- Flip Unit G3 with Small Die Flip Head (FU_SD_G3)
Vision
- Pre Align Vision (PAV)
- Dispense Vertical Indirect Illumination (DVIILL)
- Bond Vertical Indirect Illumination (BVIILL)
- Dispense Quality Check
- Bond Quality Check
- Pseudo X-ray
- Smart EVI Speed-Up
Automation
- Host communication interface
- Wafer mapping incl. map conversion
- E142 strip mapping
Miscellaneous
- Uninterruptible Power Supply to PC
- Ionizer Pick
- Ionizer Bond
- Ionizer Controlled Pick (IONC-P)
- Ionizer Controlled Bond (IONC-B)
- Ionizer Controlled Dispense (IONC-D)
- Ionizer Controlled WH Load Top (IONC-WT)
- Ionizer Controlled WH Load Bottom (IONC-WB)
- Ionizer Controlled Magazine Input (IONC-MHIN)
- Fine Filter Unit
- Fine Filter Unit with Air Particle Sensor
- Mini System for training
