Esec 2100 hS ix
The Esec 2100 hS ix is the latest member of the 2100 i Die Bonder family. It is optimized for highest speed and scratch-free transport thanks to the easy-to-use motorized and programmable rail strip handler.
More informationThis link leads to an external website.
10 micron Die placement accuracy
upto 18,500 UPH
0.2 - 10 N Bond force
>200 h MTBF
Key Features
Explore all features of the Esec 2100 hS ix
New generation designs
- High Resolution 4mega pixel Vision Systems
- Motorized and Programmable Rail Strip Handler with three clamps, optimized for scratch free production
- New reliable Strip push out to Magazine by Clamp
- New Dual Universal Top Stack and Magazine Input Handler
- New All-in-One Expansion unit for all frame sizes
Optimized productivity
- Motorized Rail Strip Handler allowing working position as close to Wafer as possible
- Superior and proven P&P design with High Performance P&P Y-axis and speed optimized trajectories
- Speed Optimized Soft Pick and Bond Processes
- Dual 5 bar Pneumatic Dispense System with independent writing axis and pressure control
Optimized process control
- High Accuracy Production Modes
- Low Contrast Object detection vision capability
- Up to three calibrated Dual Color Light Sources per camera
- Full High Definition (FHD) Graphical User Interface with multiple camera inspection images and Viewers
New generation options
- Speed optimized Pneumatic Downholder System
- High Precision Bond Head with highly accurate Theta Axis
- High Accuracy closed loop P&P Z Axis
- New High Resolution Up looking Vision System
- Automatic Tool Setups and Optimization
Specifications
The Esec 2100 hS ix in numbers
Die placement accuracy
| >2 mm: | 18 μm / 0.2° (3σ) (high speed mode) |
| 2 mm: | 12 μm / 0.2° (3σ) (accuracy mode) |
| >2 mm: | 10 μm / 0.15° (3σ) (up looking vision) |
| 0.5 – 2mm: | 20 μm / 1.0° (3σ) |
Performance
| Output | Up to 18500 UPH |
| MTBF | > 200h |
Bond process
| Bond force | 0.2 – 10 N |
| Bond rotation | 360° |
| Bond heating | programmable, max. 170 °C (simple DAF only) |
Strip Dimensions
| Width (standard) | 58 – 10 2mm |
| Width (with narrow kit*) | 23 – 67 mm |
| Length | 90 – 300 mm |
| Thickness | 0.1 – 0.5 mm |
* Option or accessory may be required
Wafer and Die Dimensions
| Wafer size: | 4” – 12” |
| Frame size | 8” – 12” |
| Die size* | 0.15 – 8 mm |
| Die thickness | > 0.075 mm |
Machine Dimensions
| Footprint | WxDxH – 1,785 x 1,448 x 1,400 mm |
| Weight | approx. 1,400 kg |
Options
Available options on the Esec 2100 hS ix
Substrate handler
- Strip Handler 100 mm hot Rail motorized
- Rail Downholder
- Pneumatic Downholder
- Magazine Handler Input
- SMEMA Link Input
- SMEMA Link Output
- Strip Marking Unit
Pick & Place
- Beam Die Sensor
- High Precision Bond Head
- Liquid Cooling System
Die ejector
- Dual Stage Die Ejector
Vision
- Dual Dispense Indirect Illumination
- Dual Dispense Vertical Indirect Illumination
- Bond Direct Illumination
- Bond Vertical Indirect Illumination
- Uplooking Vision
Automation
- Wafer Mapping inclusive Conversion
- Transfer Logging
- Material Tracking
Miscellaneous
- Uninterruptible Power Supply to PC
- Ionizer-Controlled Pick
- Ionizer-Controlled Bond
- Ionizer-Controlled Dispense
- Ionizer-Controlled WH Load Top
- Ionizer-Controlled WH Load Bottom
- Ionizer-Controlled Magazine Input
- Fine Filter Unit
- Fine Filter Unit with Air Particle Sensor
