Esec 2100 sD advanced i
The Esec 2100 sD advanced i sets a new standard in process capability with its innovative Device Height Sensor and High Precision Bond Head, ideal for demanding High BLT applications.
Enhanced process accuracy is achieved through advanced High Resolution Vision Systems, now featuring an Up Looking System.
The Dual Dispensing Module boosts productivity for high-speed applications, while Dispense Volume Control and the Low Contrast Kit elevate process control to unprecedented levels.
Additionally, auto-optimizing tool offsets and dispense pressure adjustments after syringe changes ensure consistent, reliable performance.
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8 micron Die placement accuracy
upto 1,850 UPH
0.2 - 50 N Bond force
>200 h MTBF
Key Features
Explore all features of the Esec 2100 sD advanced i
Intelligence in Accuracy
- Device Height Sensor for extreme Z-Height Control
- High Precision Bond Head with highly accurate Theta-axis
- High accuracy closed loop P&P Z-axis
- High Resolution 4 Megapixel Vision Systems
- New High Resolution Up Looking Vision System
- High Accuracy Production Modes
Intelligence in Process Control
- Low Contrast Object detection vision capability
- Three Dual Color Light Sources per camera
- Full High Definition (FHD) Graphical User Interface with multiple camera inspection images and Viewers
- Sensor status overview of vacuum, air pressure and temperatures.
Intelligence in Productivity
- Dual Dispensing Module with independent writing axes
- Dual 5 bar Pneumatic Dispense System Controller
- Superior and proven “light & rigid” P&P design
- High Performance P&P Y-axis with Liquid Cooling System
- High Performance 4th Generation Vision System
- High Speed Production Mode with excellent accuracy
Intelligence in Automation
- Automated Bond Head Tilt Adjustment
- Auto Adjusting Pick Up Tool and Capillary offsets
- Auto Adjusting Dispense Pressure after syringe change
- Constant dispensing with Dispense Volume Control
- Auto Position Adjustment of Die and Epoxy Placements
- Automatic Illumination Detection (vertical, indirect lights)
Specifications
The Esec 2100 sD advanced i in numbers
Die placement accuracy (DAF)
| > 2 mm | 15 μm / 0.15° (3σ) (high speed mode) |
| > 2 mm | 10 μm / 0.10° (3σ) (accuracy mode) |
| > 2 mm | 8 μm / 0.12° (3σ) (up looking vision) |
Die placement accuracy (Epoxy)
| > 2 mm | 18 μm / 0.2° (3σ) (high speed mode) |
| > 2 mm | 12 μm / 0.2° (3σ) (accuracy mode) |
| > 2 mm | 10 μm / 0.15° (3σ) (up looking vision) |
Performance
| MTBF | > 200h |
Bond process
| Bond force | 0.2 – 10 N |
| Bond rotation | 360° |
| Pre-bond/bond/post-bond heating | programmable, max. 200 °C |
Substrate Dimensions
| Width (standard) | 15 – 125 mm |
| Length | 90 – 300 mm |
| Thickness | 0.1 – 2.5 mm |
* Option or accessory may be required
Wafer and Die Dimensions
| Wafer size: | 4” – 12” |
| Frame size | 8” – 12” |
| Die size* | 0.5 – 20 mm |
| Die thickness | > 0.075 mm |
Machine Dimensions
| Footprint | WxDxH – 1,785 x 1,448 x 1,400 mm |
| Weight | approx. 1,600 kg / 3,500 lb |
Options
Available options on the Esec 2100 sD advanced i
Substrate handler
- Dual Input (MHIN and TOS)
- Magazine Handler Input (MHIN only)
- Raildownholder
- Motorized Downholder Disp/Bond
- Strip Marking Unit
- Strip Thickness Compensation
- Strip Handler 125 mm hot Flat with magnetic Y-Push-In
- Strip Handler 125 mm hot taped QFN
- Strip Handler 125 mm hot Stage-Z
- Substrate Blow-Off Kit
- Roll-Out Slippage Check
- Controlled Y-Axis Roll-Out
- SMEMA Link Input
- SMEMA Link Output
- Pick Strip from Box
Pick & Place
- Massflow Die Sensor
- Liquid Cooling System
- Fusion Bonding
- Parallel Pick and Place 2
Die ejector – Process Modules
- Ultra Thin Die Needle
- Ultra Thin Die Multidisc
- Ultra Thin Die Needle and Multidisc
- Dual Stage Die Ejector
Vision
- Bond Height Measurement System (BHMS)
- Dual Dispense Indirect Illumination 2 colors
- Bond Indirect Illumination 2 colors
- Dispense Vertical Indirect Illumination 2 colors
- Bond Vertical Indirect Illumination 2 colors
- Uplooking Vision
Automation
- Wafer Mapping inclusive Conversion
- Host Communication Interface
- E142 Strip Mapping
Dispense
- Dual Dispenser System DHMS (DPDS-DHMS)
- Device Z-height Control (DZHC-i)
- Epoxy Volume Measurement (EVM)
Miscellaneous
- Uninterruptible Power Supply to PC
- Ionizer-Controlled Pick
- Ionizer-Controlled Bond
- Ionizer-Controlled Dispense
- Ionizer-Controlled WH Load Top
- Ionizer-Controlled WH Load Bottom
- Ionizer-Controlled Magazine Input
- Ionizer-Controlled Transfer Table
- Air Particle Sensor
- Clean Machine Environment Kit
- Strip Cleaning Unit
- Particle Removal Kit (Pick, Disp, Bond)
