Chip Packaging
Besi’s Chip Packaging product group designs, develops, and manufactures advanced Molding, Trim & Form, and Singulation systems.
Molding machines package silicon chips under a protective epoxy layer. Trim & Form machines shape the leads of chips, laser marks them and separates the products from a leadframe. Singulation machines singulazizes the chips by sawing them into single units.
All chip packaging systems are designed at Besi’s Center of Excellence in the Netherlands, ensuring the highest standards of quality and innovation. Explore our extensive product portfolio across these three core areas to find the perfect solution for your chip packaging needs.
Molding
Besi’s Molding product group specializes in designing and manufacturing high-precision molding systems that protect silicon chips with a durable epoxy layer. The advanced molding equipment ensures reliable encapsulation, protecting delicate semiconductor components during further processing and in end-use applications.
Engineered with cutting-edge technology at Besi’s Center of Excellence in the Netherlands, our molding systems deliver exceptional quality, efficiency, and flexibility to meet the different needs of the semiconductor industry. Whether you require high throughput or specialized molding capabilities, Besi offers a comprehensive portfolio tailored to optimize your packaging process.
Explore our range of molding solutions and discover how Besi can help you enhance product reliability and performance.
Trim & Form
Besi’s Trim & Form product group specializes in designing and manufacturing high-precision trim & form systems that shape the leads of semiconductor packages. In addition, a wide range of modules enables extra manipulation of product carrier strips, full vision inspection, and laser marking of devices.
Engineered with cutting-edge technology at Besi’s Center of Excellence in the Netherlands, our trim & form systems deliver exceptional quality, efficiency, and flexibility to meet the diverse needs of the semiconductor industry. Whether you require a solution for high-end logic devices or the production of power products, Besi offers a comprehensive portfolio tailored to optimize your packaging process.
Explore our range of Trim & Form solutions and discover how Besi can help you enhance product reliability and performance.
Singulation
The Besi singulation machines are renowned for their innovation, quality, reliability, and ability to deliver high-volume output. Each system is engineered to meet the challenges of today’s increasingly demanding manufacturing processes, significantly increasing yields while maintaining a low cost of ownership.
Designed for fully automatic, 24/7 singulation of all array-based packages, these machines incorporate vision systems at all critical stages to ensure the highest product and process quality. This comprehensive approach safeguards both the equipment and the devices being processed.
