Die Attach

Hybrid Bonding is an innovative technology that combines multiple materials and components at the microscopic level to create highly advanced semiconductor packages. This method enhances the performance and density of interconnects, making it ideal for next-generation applications in electronics, including high-end modules and advanced packaging solutions.

Besi’s Hybrid Bonding platform utilizes cutting-edge cleanliness concepts and exceptional optical alignment techniques to achieve superior placement accuracy, ensuring manufacturers can produce high-density interconnects and facilitate 3D integration with remarkable efficiency.

As the semiconductor industry continues to evolve, Besi’s Hybrid Bonding technology stands out as a vital solution for achieving higher yield and performance standards on production floors. By focusing on process development and leveraging advanced capabilities, Besi empowers manufacturers to meet the increasing demands of modern electronics while maintaining the highest quality and reliability in their products.

At Besi, our thermo compression bonding (TCB) systems are engineered to meet the demanding requirements of today’s advanced semiconductor packaging technologies.

Designed for precision, reliability, and scalability, our TCB equipment enables superior bonding quality for a wide range of applications including chiplet integration, interposer assembly, and wafer-level packaging.

Whether you are focused on R&D or high-volume manufacturing, each innovative TCB solution delivers the performance and flexibility needed to drive your packaging processes forward with confidence and efficiency.

Explore our portfolio to find the perfect system tailored to your specific bonding challenges.

As semiconductor devices become increasingly complex, efficient and precise multi-module assembly is essential to meet production demands and maintain product quality.

Besi’s Multi Module Attach equipment is engineered to deliver high throughput, exceptional accuracy, and flexibility for attaching multiple components simultaneously. Our advanced systems support a wide range of applications, enabling manufacturers to optimize their assembly processes while reducing costs and cycle times.

Discover how Besi’s innovative multi-module attach solutions can enhance your production capabilities and drive success in today’s competitive semiconductor market.

In back-end semiconductor manufacturing, the die attach process is a critical step. At first glance, die attach seems to be a simple process step in the semiconductor manufacturing chain. However, the continuously increasing requirements of today’s applications set high standards in die bonding. Besi’s die attach equipment is based on unique and innovative concepts offering economical benefits to customers.

The soft solder die bonding systems of Besi are designed to deliver exceptional precision and consistency for a wide range of semiconductor packaging applications.

Engineered to provide strong, reliable joints with excellent thermal and electrical performance, our equipment supports both research and high-volume production needs.

Whether you are working with complex die materials or demanding process requirements, Besi’s soft solder die bonding solutions offer the flexibility and control necessary to optimize your assembly process and ensure superior product quality.

Explore our portfolio to find the ideal system for your soft solder die bonding challenges.