Leadframe Plating

At Besi we understand the ever-increasing demands of modern semiconductor packaging: higher lead densities, thinner leadframes, tighter spot tolerances and faster throughput. Our Leadframe Plating product group delivers advanced solutions to meet those needs. Whether it is selective silverspot plating, high-speed reel-to-reel processing or integrated deflash and plating lines. With flexible, stand-alone or fully integrated Meco systems, we provide equipment that scales with your innovation roadmap, enabling precision, yield and performance, all in one streamlined package.