Leadframe wet processing

In semiconductor assembly, precise and reliable leadframe wet processing is essential to ensure optimal surface preparation and cleaning, which directly impacts device performance and yield.

Besi’s wet processing systems for leadframes are engineered to deliver consistent, high-quality results through innovative design and robust process control. Our solutions support a wide range of applications, providing manufacturers with the efficiency, flexibility, and reliability needed to meet the evolving demands of the semiconductor industry.

Discover how Besi’s expertise in wet processing can enhance your production line and improve overall product quality.