Molding

Besi’s Molding product group specializes in designing and manufacturing high-precision molding systems that protect silicon chips with a durable epoxy layer. The advanced molding equipment ensures reliable encapsulation, protecting delicate semiconductor components during further processing and in end-use applications.

Engineered with cutting-edge technology at Besi’s Center of Excellence in the Netherlands, our molding systems deliver exceptional quality, efficiency, and flexibility to meet the different needs of the semiconductor industry. Whether you require high throughput or specialized molding capabilities, Besi offers a comprehensive portfolio tailored to optimize your packaging process.

Explore our range of molding solutions and discover how Besi can help you enhance product reliability and performance.