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Plating & Cleaning

Meco designs and supplies continuous plating and leadframe cleaning systems tailored for the electronics industry. With over 30 years of expertise, Meco’s systems have earned an international reputation for exceptional performance, outstanding reliability, superior quality, and unmatched cost-efficiency.

Backed by decades of experience in plating design and manufacturing, Meco supports customers worldwide through a global network of sales and service centers. Beyond delivering top-quality, highly reliable plating systems, Meco offers comprehensive turnkey solutions—including installation, production start-up assistance, quality control support, and all necessary process chemistry, hardware, and accessories.

Leadframe wet processing

Leadframe wet processing

In semiconductor assembly, precise and reliable leadframe wet processing is essential to ensure optimal surface preparation and cleaning, which directly impacts device performance and yield.

Besi’s wet processing systems for leadframes are engineered to deliver consistent, high-quality results through innovative design and robust process control. Our solutions support a wide range of applications, providing manufacturers with the efficiency, flexibility, and reliability needed to meet the evolving demands of the semiconductor industry.

Discover how Besi’s expertise in wet processing can enhance your production line and improve overall product quality.

Leadframe Plating

Leadframe Plating

At Besi we understand the ever-increasing demands of modern semiconductor packaging: higher lead densities, thinner leadframes, tighter spot tolerances and faster throughput. Our Leadframe Plating product group delivers advanced solutions to meet those needs. Whether it is selective silverspot plating, high-speed reel-to-reel processing or integrated deflash and plating lines. With flexible, stand-alone or fully integrated Meco systems, we provide equipment that scales with your innovation roadmap, enabling precision, yield and performance, all in one streamlined package.

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