Soft Solder Die Bonding

The soft solder die bonding systems of Besi are designed to deliver exceptional precision and consistency for a wide range of semiconductor packaging applications.

Engineered to provide strong, reliable joints with excellent thermal and electrical performance, our equipment supports both research and high-volume production needs.

Whether you are working with complex die materials or demanding process requirements, Besi’s soft solder die bonding solutions offer the flexibility and control necessary to optimize your assembly process and ensure superior product quality.

Explore our portfolio to find the ideal system for your soft solder die bonding challenges.