Thermo Compression Bonding

At Besi, our thermo compression bonding (TCB) systems are engineered to meet the demanding requirements of today’s advanced semiconductor packaging technologies.

Designed for precision, reliability, and scalability, our TCB equipment enables superior bonding quality for a wide range of applications including chiplet integration, interposer assembly, and wafer-level packaging.

Whether you are focused on R&D or high-volume manufacturing, each innovative TCB solution delivers the performance and flexibility needed to drive your packaging processes forward with confidence and efficiency.

Explore our portfolio to find the perfect system tailored to your specific bonding challenges.