Trim & Form

Besi’s Trim & Form product group specializes in designing and manufacturing high-precision trim & form systems that shape the leads of semiconductor packages. In addition, a wide range of modules enables extra manipulation of product carrier strips, full vision inspection, and laser marking of devices.

Engineered with cutting-edge technology at Besi’s Center of Excellence in the Netherlands, our trim & form systems deliver exceptional quality, efficiency, and flexibility to meet the diverse needs of the semiconductor industry. Whether you require a solution for high-end logic devices or the production of power products, Besi offers a comprehensive portfolio tailored to optimize your packaging process.

Explore our range of Trim & Form solutions and discover how Besi can help you enhance product reliability and performance.