Completed EU projects
On this page, the completed EU projects in which Besi has participated are listed. The overview highlights Besi’s involvement in a variety of European research and innovation initiatives across multiple sectors. Each project reflects our commitment to advancing technology and collaboration within the EU framework, showcasing our role in contributing to the development of cutting-edge solutions and industry advancements.
GaNext
The Next Generation GaN Power Module project (GaNext) aimed to eliminate the barriers to adopting Gallium Nitride (GaN) semiconductors by fully demonstrating the superior efficiency and compactness of GaN-based power systems. The primary deliverable of the project was an intelligent GaN power module that integrated or co-packaged the gate drive, control, and protection circuits alongside the power device.
Charm
The CHARM ECSEL JU project aimed to develop industrial IoT solutions with enhanced tolerance to harsh industrial environments. Digitalisation of European manufacturing industries is crucial for their ongoing renewal and competitiveness. However, harsh environmental conditions in manufacturing processes and end-user settings have the potential to hinder the opportunities offered by IoT (Internet of Things) and AI (Artificial Intelligence). The CHARM project was designed to address and overcome this challenge.
Applause
The drive for new technology in advanced packaging for photonics, optics, and electronics has created an opportunity to strengthen Europe’s competitive edge in component and systems development while revitalizing the European manufacturing and packaging value chain. The ECSEL JU project APPLAUSE (No. 826588) supports this goal by leveraging European expertise in advanced packaging and assembly to develop new tools, methods, and processes for high-volume mass manufacturing of electrical and optical components. These technologies were piloted in six industrial use cases, including ambient light sensors for mobile and wearable applications, thermal IR image sensors for automotive and surveillance applications, high-speed datacom transceivers, flexible patches for cardiac monitoring, miniaturized invasive cardiac sensors, and optical humidity measurement modules.
EuroPAT-MASIP
The European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-In-Package (EuroPAT-MASIP) project reinforced the European semiconductor manufacturing position by focusing on the Integrated Circuit and MEMS packaging ecosystem. The project aimed to accelerate the manufacturing uptake of advanced packaging technologies and shorten time-to-market by demonstrating new capabilities through need-based Application Pilots.
PowerBase
PowerBase, an ECSEL project involving 39 partners from 9 European countries, enabled growth potential and strategic independence for Europe’s semiconductor industry in response to increased globalization.
ATHENIS 3D
ATHENIS 3D was an FP7/European-funded project involving eleven partners from five countries that developed a new technology platform for automotive electronics. This innovative IC platform enabled electronic engineers to integrate more functionality onto a single chip at lower costs. The project achieved this by combining advanced More than Moore devices with More Moore devices (90nm and 14nm CMOS) using Through Silicon Vias (TSV) and Wafer Level Packaging (WLP). The resulting technology was designed to withstand the harshest automotive conditions, including temperatures up to 200°C and voltages up to 200V. ATHENIS-3D demonstrated significant cost savings through integration and achieved a fivefold reduction in PCB area.
InForMed
In the InForMed project, an integrated pilot line for medical devices was established, covering the complete innovation chain from technology concept to system qualification. It included micro-fabrication, assembly, and even the fabrication of smart catheters. Uniquely, the integrated pilot line was hosted by a large industrial end-user and was specifically targeted and equipped to bridge the gap in the landscape of micro-fabrication of medical devices between concept creation and full-scale production.
EAST
EAST (smart Everything everywhere Access to content through Small cells Technologies) developed key enablers for 5G small cell mobile networks operating up to 6 GHz. The project targeted enhanced data rates with video bandwidths exceeding 100 MHz, significantly higher integration achieving 10x to 100x size reduction, advanced functionality including MIMO, and reconfigurability with multiple transmit bands. Major advancements were pursued both at the system and design level, through novel transmitter architectures, and at the technology level, via new silicon processes and packaging solutions. The outcomes of EAST positioned Europe as a technology leader in the emerging 5G market.
Enlight
Energy efficiency and sustainability were major concerns in society. The lighting industry underwent a radical transformation driven by rapid progress in LED lighting, semiconductor technology, and the need for sustainable and energy-efficient solutions. The EnLight project delivered new technology and applications that inspired and enabled designers in ways far beyond conventional lighting.
