Die-to-wafer hybrid bonding development for High Volume Manufacturing
Jonathan Abdilla Et al.
As the demands of high-performance computing (HPC) and artificial intelligence (AI) grow, traditional semiconductor packaging methods like flip-chip bonding face limitations in scalability and reliability.
This article explores the advanced die-to-wafer (D2W) hybrid bonding process, which offers significant improvements by using copper-to-copper (Cu-Cu) connections. We will discuss key process steps, such as wet cleaning, degassing, and plasma surface treatment, and present data on Cu-Cu diffusion, void formation, and placement accuracy.
This comprehensive overview highlights how D2W hybrid bonding enhances system-level performance and is essential for high-volume manufacturing in advanced semiconductor packaging.
