Scientific publications
The Scientific publication pages feature Besi’s latest scientific research and technical insights in semiconductor assembly and packaging.
Explore peer-reviewed papers, conference proceedings, and collaborative studies that demonstrate Besi’s commitment to innovation and advancing electronic manufacturing technologies. Stay informed on the scientific breakthroughs shaping the future of the industry.
Sub micron placement accuracy – the era for heterogeneous integration and optoelectronic assemblies
Sub micron placement accuracy - the era for Heterogeneous Integration and opto electronic assemblies
Heterogeneous Integration is key to overcome limitations in packaging technology. This abstract addresses these challenges.
Molding process
Influence of Transfer Molding Process on the Reliability of High Mass Epoxy Mold Compound Molded Package
Explore how pellet preheating improves overmolding of power modules by reducing porosity and thermal oxidation, enhancing encapsulation reliability under high-temperature aging.
Next generation of Thermo-Compression Bonding Equipment
Next generation of Thermo-Compression Bonding Equipment
Discover how advanced thermocompression bonding tackles chip size challenges to sustain Moore’s law with unmatched precision and reliability.
Thermo compression bonding for large dies under protective atmosphere
Thermo compression bonding for large dies under protective atmosphere
Thermo Compression Bonding for large dies up to 80mm uses low gas consumption and oxidation prevention for reliable high-density semiconductor bonding.
Die-to-wafer hybrid bonding development for High Volume Manufacturing
Die-to-wafer hybrid bonding development for High Volume Manufacturing
Die-to-wafer hybrid bonding with Cu-Cu connections boosts HPC and AI packaging, improving reliability, accuracy, and scalability for high-volume manufacturing.
Materials and solutions for power package die bonding
Materials and solutions for power package die bonding
Power electronics packaging advances with die bonding techniques like soft-solder, conductive adhesives, and sintering for improved performance and reliability.
High-Accuracy Pick-and-Place of Multiple Dies in Parallel Assisted by Capillary Self-Alignment
High-accuracy pick-and-place of multiple dies in parallel assisted by capillary self-alignment
Self-assembly using liquid surface tension enables high-accuracy die alignment with low-precision pick-and-place, achieving <3μm accuracy and high throughput in packaging.
Toward improved FOWLP manufacturing by using self-alignment process
Toward improved FOWLP manufacturing by using self-alignment process
Collaboration with Fraunhofer advances FOWLP using plasma-treated surfaces for precise self-alignment and die placement.
High-speed ultra-accurate direct C2W bonding
High-speed ultra-accurate direct C2W bonding
Chip-to-wafer hybrid bonding is needed as contact pitch and pad size decrease to the single micrometer range (5 micrometer or lower). Here, classical bonding technologies like themo-compression bonding and flip-chip with mass reflow are no longer sufficient, and hybrid bonding emerges as an attractive alternative.