Next generation of Thermo-Compression Bonding Equipment

As transistor technology node scaling slows down, alternative approaches are being explored to sustain the momentum of Moore’s law.

Chip sizes have now reached reticle limits, posing challenges for adding more features. Additionally, large dies come with their own set of disadvantages, including reduced yield, longer time to market, increased complexity, higher design and engineering costs, limited flexibility for customization, and an inability to utilize different nodes for various architectures to reduce costs.

While material selection is a critical aspect which can help, packaging has more prominently taken the spotlight. A stateof-the-art thermocompression bonding (TCB) equipment has been proven to achieve sub micron accuracy, and implementation of a no flux TCB process with hydroxyl reduction proven via cross sectioning of specimens. Innovative ways to deal with search inaccuracies performed by cameras induced from elevated temperatures are also presented with nm repeatability.